Qing-An Huang received the B.S. degree from the Hefei University of Technology, Hefei, China, in 1983; the M.S. degree from Xidian University, Xi’an, China, in 1987; and the Ph.D. degree from Southeast University, Nanjing, China, in 1991, all in electronics engineering. His Ph.D. research was focused on micromachined GaAs piezoelectric sensors.
He joined the Department of Electronic Engineering, Southeast University, after graduation, where he became a Full Professor in 1996, and was appointed as the Chang-Jiang Scholar by the Ministry of Education in 2004. He was a visiting scholar at the Hong Kong University of Science and Technology from 1997 to 1998, and a senior visiting scholar (1 month) at the Berkeley Sensor and Actuator Center, University of California at Berkeley in 2017. He has been the Founding Director of the Key Laboratory of MEMS (the Ministry of Education) with the Southeast University since 2001. He has authored a book Silicon Micromachining Technology (Science Press, 1996), edited a book Micro Electro Mechanical Systems (Springer, 2018), authored or co-authored 4 international book chapters, over 200 peer-reviewed international journals/conference papers, and holds over 100 Chinese patents. He is a Fellow of the IEEE. He was a recipient of the National Outstanding Youth Science Foundation Award of China in 2003.
Dr. Huang was a TPC Member of TRANSDUCERS from 2009 to 2019 and IEEE SENSORS Conference from 2002 to 2015. He was the Conference Co-Chair of the SPIE Microfabrication and Micromachining Process Technology and Devices (Proceedings of SPIE, vol. 4601, 2001), the TPC Co-Chair of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS, Kyoto, Japan, 2012), and the TPC Co-Chair of the 6th Asia-Pacific Conference of Transducers and Micro/Nano Technologies (APCOT, Nanjing, China, 2012). He has been serving as the Editor-in-Chief of the Chinese Journal of Sensors and Actuators since 2005. He is an Editorial Board Member of the Journal of Micromechanics and Microengineering.